SBC-477-TS570 Rugged SBC with Intel® Xeon® W-11865MRE COM Express Type 6 Module on Carrier and USB 3.0

The SBC-477-TS570 is a rugged small form factor embedded computer designed for high-performance applications. It features an Intel® Xeon® W-11865MRE processor for energy-efficient processing for demanding applications. The COM Express Type 6 Module mounted on a COM Express Type 6 Basic carrier provides Mini PCIe expansion and 4 x USB 3.0 and 2x USB 2.0 connectivity. Engineered for extreme conditions, it operates reliably within an extended temperature range of -40°C to +70°C with an appropriate thermal solution.

This embedded SBC-477-TS570 system includes on-board discrete TPM 2.0 hardware security, supports multiple display configurations, and offers versatile expansion options. It is compatible with Linux, Windows 10 IoT, Windows 11 IoT, and other x86 real-time operating systems. SBC-477 Family comparison

-40°C to +70°C

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Features

  • Compact form factor for space-constrained applications
  • Intel Xeon W-11865MRE
  • -40°C to +70°C extended temperature range with thermal solution
  • Extended product life cycle of 10+ years
  • High MTBF
  • Ruggedized locking pin header connectors
  • Mini PCIe expansion
  • 4x USB 3.0 and 4x USB 2.0