COMeT6-1100 COM Express® Type 6 Compact Module with 11th Gen. Intel® Core™ Processor

The COMeT6-1100 is an industrial COM Express Type 6 Compact module with an 11th Gen Intel® Core™ i3/i5/i7 Processor. This industrial module is designed and manufactured in the USA. The small form factor processor mezzanine can be plugged onto a carrier board that contains user-specific I/O requirements to provide intelligent design for long-life industrial automation, energy and storage, industrial building equipment, transportation and logistics and similar rugged applications.

PRODUCT INFO

COM Express® Type 6 Compact Module with 11th Gen. Intel® Core™ Processor

-40° C to +85° C

ROHS COMPLIANT

MADE IN THE USA

Features
Processor Options	Intel Core i7-1185GRE Intel Core i5-1145GRE Intel Core i3-1115GRE Intel Core i7-1185G7E* Intel Core i5-1145G7E* Intel Core i3-1115G4E* Intel® Celeron® 6305E* * Special Order
BIOS	AMI UEFI in Quad-SPI Flash with Intel AMT support
Memory	Up to 32GB LPDDR4 4266 MT/s (2133MHz) System Memory Commercial and Industrial memory options available (see ENVIRONMENTAL specifications)
Storage	2x SATA III (6 Gb/s)
Display	Four independent video outputs − 3x Digital Display Interface (DDI) to DisplayPort++ / HDMI / DVI − 1x eDP (optional LVDS) − 1x VGA
Expansion	PCIe Gen4 x4 for PEG or NVMe 5x PCIe lanes configurable to (4×1 (Default), 2×1 + 1×2, or 1×4) and Lane 4 (x1 only) 4x USB 3.2 Gen 1, 8x USB 2.0 1x i226 2.5 Gb/s Ethernet RGMII Intel HD Audio 2x UART with console redirection 4x GPI, 4x GPO (SDIO option for MicroSD socket)
Power	Standard 12V Input, +/- 10%. CPU TDP = 28W max, software controllable to reduce to 15W or 12W TDP
Software	Broad OS Support, including Windows10, Windows 11, Ubuntu, Red Hat, and other x86 operating systems Custom configurable UEFI-based AMI BIOS System Management Libraries and Tools
Environmental	Commercial Temperature: 0ºC to +60ºC (32ºF to +140ºF)1 Industrial Temperature: -40ºC to +85ºC (-40ºF to +185ºF)1 CE Compliant 1 Requires thermal solution via heat spreader/heatsink and/or airflow
Mechanical	Dimensions – 3.75 in x 3.75 in (95 mm x 95 mm) • Weight – 2.75 oz (78 g) • PC Board thickness 0.078 inches (2 mm) Note: Above dimension data does not include the height of thermal solution options. See mechanical drawings.
Thermal Solutions	Heat Spreader Options: • COMeT6-460-SPRD-0 Spreader through-hole • COMeT6-460-SPRD-1 Spreader threaded Heat Sink Options: • COMeT6-460-HTSK-0 Heat sink through-hole, no fan • COMeT6-460-HTSK-1 Heat sink threaded, no fan • COMeT6-460-HTSKF-0 Heat sink through-hole *with fan* • COMeT6-460-HTSKF-1 Heat sink threaded *with fan*